Buy 205-0059-001 Part of Dpac Technologies Corp with NSN 5962-01-356-6553
MPN: 205-0059-001
Alternate P/N: 2050059001
Manufacturer: Dpac Technologies Corp
NSN: 5962-01-356-6553
Item Name: Microcircuit Assemb
CAGE Code: 66847
Part number 205-0059-001 is available for immediate shipping. The NSN for part number is 5962013566553. This part is manufactured by Dpac Technologies Corp. It is described as Microcircuit Assemb. Would you like to request a quote for part number 205-0059-001? Please fill out the form.
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NSN Information for Part Number 205-0059-001 with NSN 5962-01-356-6553, 5962013566553
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-356-6553 Item Description: Microcircuit Assemb | 5962 | 013566553 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 205-0059-001 | 5 | 2 | 3 |
Characteristics Data of NSN 5962-01-356-6553, 5962013566553
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.999 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.999 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.170 INCHES NOMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND BURN IN AND RADIATION HARDENED AND STATIC OPERATION |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 4 MEMORY |
| FEAT | SPECIAL FEATURES | NUCLEAR HARDNESS CRITICAL ITEMS |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 31 PIN |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| CZER | MEMORY DEVICE TYPE | RAM |
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