Buy 28C64A 15 Part of Microchip Technology Inc with NSN 5962-01-330-5534
MPN: 28C64A 15
Alternate P/N: 28C64A15
Manufacturer: Microchip Technology Inc
NSN: 5962-01-330-5534
Item Name: Microcircuit Memory
CAGE Code: 60991
Part number 28C64A 15 is available for immediate shipping. The NSN for part number is 5962013305534. This part is manufactured by Microchip Technology Inc. It is described as Microcircuit Memory. Would you like to request a quote for part number 28C64A 15? Please fill out the form.
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NSN Information for Part Number 28C64A 15 with NSN 5962-01-330-5534, 5962013305534
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-330-5534 Item Description: Microcircuit Memory | 5962 | 013305534 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 28C64A 15 | 2 | 1 | 5 |
Characteristics Data of NSN 5962-01-330-5534, 5962013305534
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 0.540 INCHES MINIMUM AND 0.560 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.442 INCHES MINIMUM AND 0.458 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | W/ENABLE AND W/INHIBIT AND MONOLITHIC AND ERASABLE AND PROGRAMMABLE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 24 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-12 MIL-M-38510 |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 6.25 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | ROM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 32 LEADLESS |
| ADAU | BODY HEIGHT | 0.060 INCHES MINIMUM AND 0.120 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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